12-inch (305.0 mm) Diamond Wafering Blade Resin Bonded (EACH)
Product Code: WB-12-R

12-inch (305.0 mm) Diamond Wafering Blade Resin Bonded (EACH)

Product Code: WB-12-R
Availability: 1000
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Item specifics

  • Arbor 0.5" (12.7 mm)
  • Bond Resin Bond
  • Concentration High Concentration
  • Size 12-inch (305.0 mm)
  • Thickness .062-inch (1.57 mm)

Product Description

Diamond Wafering Blade Resin Bonded Recommended for aggressive cutting, ferrous and non-ferrous materials,for hard, delicate or brittle materials

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