8-inch x 0.035-inch x 0.5-inch - Diamond Cut-off Wheel, High Concentration, (1/Pkg)
Product Code: WB-8-H

8-inch x 0.035-inch x 0.5-inch - Diamond Cut-off Wheel, High Concentration, (1/Pkg)

Product Code: WB-8-H
Availability: 1000
Viewed 10027 times
 

Item specifics

  • Type Metal Bonded
  • Concentration High Concentration
  • Size 8-inch (203.0 mm)
  • Thickness 0.035-inch (0.9 mm)
  • Arbor 0.5" (12.7 mm)

Product Description

Diamond Wafering Blade High Concentration Recommended for metal matrix composites, titanium, thermal spray coatings, printed circuit boards, bones. Also excellent for cutting rock, re-factory, mineral, ceramic, glass, cement, concrete, and other non-metallic materials.

For general use with ferrous and non-ferrous alloys; copper, aluminum, metal matrix composites, PCB boards, bones, thermal spray coatings and titanium alloy.

For cutting of ceramics and minerals (> HV 800). 

For cutting of ceramics and minerals (> HV 800).  

For manual cutting of minerals and composites with hard phases. 

For manual cutting of minerals and composites with hard phases. 

For cutting of ceramics and minerals (> HV 800). Can be used with manual cutting table.  

For cutting of ceramics (> HV 800) and minerals.

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