6-inch x 0.019-inch x 0.5-inch - Diamond Cut-off Wheel, Low Concentration, (1/Pkg)
Product Code: WB-6-L

6-inch x 0.019-inch x 0.5-inch - Diamond Cut-off Wheel, Low Concentration, (1/Pkg)

Product Code: WB-6-L
Availability: 1000
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Item specifics

  • Type Metal Bonded
  • Concentration Low Concentration
  • Size 6-inch (152.0 mm)
  • Thickness 0.019-inch (0.5 mm)
  • Arbor 0.5" (12.7 mm)

Product Description

Diamond Wafering Blade Low Concentration Recommended for cutting brittle materials that would be found with certain glasses and ceramics, also for ceramics, glass, alumina, zirconia, concrete, electronic substrates. 

Diamond Cut-off Wheel for precision cutting of ceramics and minerals. For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete, hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides.  

For cutting of hard and brittle materials, minerals and ceramics (750 < HV < 2000)

For cutting of sintered carbides and ceramics (750 < HV < 2000)

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